NEPCON ASIA 2020 is a professional exhibition focusing on SMT and electronic manufacturing automation technology in the electronics manufacturing industry. As a high-quality exhibition for the electronics manufacturing industry in Asia, the annual NEPCON will stage a top feast in the electronics manufacturing field of the year.

As a leading expert in the field of industrial automation and intelligent modular assembly equipment in the country, Anda will bring the company's "star products" to the exhibition and share with you the "high-speed dispensing equipment" and "high-speed dispensing equipment" used in the SM process section of the 3C industry chain. "Intelligent selective coating overall solution".

Wonderful presentation, we sincerely invite you to come!

Booth highlights

iJet-7H Dispenser

Application areas:

Underfill, FPC packaging, hot melt glue for mobile phone frame, SMT red glue, LED lens glue, IC edge packaging, etc.

ADG-5DI five-axis high-speed dispenser

Application range:

Hot melt glue, underfill, red glue, component package fixation, etc. for mobile phones and tablet devices

iCoat-5 Precision Coating Machine

Application range:

Selective coating of the front and back of the substrate, precise selective coating of components and pins, etc.

5DG-APR automatic plasma cleaning machine

(This thread body is independently developed by Anda)

Mobile phone automatic assembly line scheme

You can love the new and hate the old

Anda can satisfy you

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Looking forward to your visit